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10:30 - 10:35

Greeting from the Chairman of the JISSO/PROTEC Forum Organizing Committee
Yoshishiko Misawa

10:35 - 10:40

Introduction of keynote speakerHisao Kasuga
NEC Electronics Corporation

10:40 - 12:00

“Exploit of new market and key technology for JSSO ”Kanji Otsuka
Special Advisor
Meisei University

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12:40 - 12:45

Introduction of Sessions
Kunishiko Nishi
Chief Engineer ,MONOZUKURI Engineering Support Center, MONOZUKURI Engineering Division
Hitachi, Ltd.

12:45 - 13:45

“Japan’s Electronics Industry in Transition--Strengthening International Competitiveness”Naoki Yamamoto
A.T. Kearney, Inc.

13:45 - 14:45

“Potential of Digital Household Electric Appliances and Strategies of Manufacturing Industry in Japan”Yohei Kanazawa
Equity Research, Director
Nikko Citigroup Limited

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15:00 - 15:05

Introduction of Sessions
Tsunoi Kazuhisa
Director Component Packaging Dept.
FUJITSU LIMITED

15:05 - 15:45

“Packaging Technology of the World’s Smallest HDD”Happoya Akihiko
Ome Complex Packaging Technology Center Group1Group Manager
Toshiba corporation

15:45 - 16:25

“Response to Lead-free Implementation Technology of Mobile Phones and Various Problems”Toshiyuki Shimura
Section No.2 Common Engineering Department BU JP
Sony Ericsson Mobile Communications Japan,Inc.

16:25 - 17:05

“Mounting Technology of Mobile-Computer”Tsunoi Kazuhisa
Director Component Packaging Dept.
FUJITSU LIMITED

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12:40 - 12:45

Introduction of Sessions
Hiroshi Manita
LSI Technology Group Core Technologies R&D Div. Assistant Manager
Casio Computer CO.,LTD.

12:45 - 13:25

“ The Proposal for Circulation Promotion of System-in-Package-Electronic System Integration Packaging Technology Committee Activity Report- ”Hiroshi Manita
Chairperson
JEITA Electronic System Integration Packaging Technology Committee

13:25 - 14:05

“Recent Trends in Electronic Paper”Heeday Danjo
Electronic Paper Initiative
TOPPAN Printing Co., Ltd.

14:05 - 14:45

“Trends of Fuel Cell for Mobile Electronic Systems”Susumu HONDA
director
NPO Circuit-Network

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15:00 - 15:05

Introduction of Sessions
Kiyoshi Matsui
Car Electronics Sales Division ,Electronic Components Sales & Marketing Group
TDK Corporation

15:05 - 15:45

“Technology Movement and Implementation Technology of Electrically Conductive Macro Molecule Electrolysis Condenser”Hiroshi Tanaka
Electronic　Device　Company　Technology Planning Section.
SANYO Electric Co.,Ltd.

15:45 - 16:25

“Movement for Miniaturization of Multilayer Ceramic Capacitor and Implementation Technology”Yukio Tanaka
Components Business Unit, Research & Development Group, JISSO Engineering Department, General Manager
Murata Mfg.Co.,Ltd.

16:25 - 17:05

“Rapid and accurate analysis of substances regulated by the RoHS directive"Masahiro Oishi
Technology Group, Materials Analysis Center
TDK Corporation

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12:30 - 12:35

Introduction of Sessions
Tokio Shirakawa
Manager, SE Team, Product Planning Group
Panasonic Factory Solutions Co., Ltd.

12:35 - 13:25

“01005 micro chip component and SMT Equipments”Katsuhiko Ohno
Manager, SE Team, Product Planning Group
Panasonic Factory Solutions Co., Ltd.

13:25 - 14:15

“Jisso technologies for next-generation mobile devices”Morita Takeshi?Tomoyasu Kazuhiko
Electronic Component Mounting Systems & Solution Business Unit
Panasonic Factory Solutions Co., Ltd.

14:15 - 15:05

“Latest Jisso Technology and Equipment”Tomohiko Hattori
Technical Development Center
Fuji Machine Manufacturing Co.,Ltd.

15:05 - 15:20

Recess

15:20 - 16:10

“The most advanced Jisso Technology."Toshiyuki Kusunoki?Naonobu Ookawa
IM Company SMT Engineering Group
YAMAHA MOTOR Co.,LTD.

16:10 - 17:00

“Stencil-Free Jet Printer : MY500”Toshimitsu SAKAKI
Sales Engineering
MYDATA Automation K.K.

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12:30 - 12:35

Introduction of Sessions
Ryo Haruta
Package Engineering Department
Renesas Technology Corp.

12:35 - 13:15

“3D technology development in chip-stacked SiP”Hirofumi Nakajima
Advanced device development division
NEC Electronics Corp.

13:15 - 13:55

“Advanced SiP･PoP Packaging Technology Development using SMT Process"Yasumitsu Orii
Engineering & Technology Services, High Density Packaging Development, Manager
IBM Japan, Ltd.

13:55 - 14:35

“EAD Type SiP Technology”Takeshi Wakabayashi
CASIO COMPUTER CO.,LTD.

14:35 - 15:15

“Modeling technique by using the thermal deformation measurement system based on Digital image Correlation method.”Nishio Toshihiko
Engineering & Technology Services, Technology director
IBM Japan, Ltd.

15:15 - 15:30

Recess

15:30 - 16:10

“Thin Chip Technology For System in Package”Tomoo Hayashi
B.G.GROUP
Tokyo Seimitsu Co.,LTD

16:10 - 16:50

“Molding technology for System in Package”Kazuhiro　Arai
Application Engineering Dept.　Assistant Manager
SHINKAWA　LTD.

16:50 - 17:30

“Molding technology for System in Package”Tomonori Himeno
MARKETING DEPT. MOLD DEC. SENIOR STAFF
TOWA Corporation

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10:30 - 10:35

Introduction of Sessions
Tadashi Habu
Tadashi Habu
Murata Manufacturing Company, Ltd.

10:35 - 11:05

“Technical trend of new bulk packaging”Joji Kobayashi
Components Business Unit, Research & Development Group, JISSO Engineering Department, SMT & Package Engineering Section Manager
Murata Mfg.Co.,Ltd.

11:05 - 11:35

“Bulk Mounting For Chip Resistors”Hideyui Miura
Sales Department Sales Engineering Group

11:35 - 12:05

“Bulk Arrangement in Inline Implementation in Various Kind Variable Cell Production”Yusuke Mori
Production　Engineering　Section　Manager
SUNX Limited

12:05 - 12:35

“Bulk chip placement in clean room and its measures to prevent from getting wrong value parts mixed”Osamu Maki
SMT Equipment (ounting(SMT) Manufacturing Dept.

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13:30 - 14:10

“Suppression　technique　of tin whisker formation；JMI （JVC　Micro- Island）method　＆　plating technology”Makoto Takeuchi
Production　Engineering　Div., Production　Engineering　Lab. Senior Staff Engineer
Victor　Company　of　Japan,　Limited

14:10 - 14:50

“Whisker-Restrained Pb-Free Solder”Yoshitou Hayashida
ASSEMBLY MATERIALS R&D
TAMURA KAKEN CORPORATION

14:50 - 15:30

"A test method to judge lead content in lead-free solder to be it by a change of a color of a special chelating reagent."
Kunio Nakajima
Center President Chemical Development Research Institute
G.W．International,Inc.

15:30 - 15:45

Recess

15:45 - 16:25

“The Latest Trend of Lead-free Solder technology ”Yoshitaka Toyoda
Research & Development Technicalcenter Manager

16:25 - 17:05

“The latest trend of Sn-Zn solder”Koichi Hagio
Deputy General Manager Technical Department

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10:30 - 10:35

Introduction of Sessions
Henry H. Utsunomiya
President
Interconnection Technologies, Inc.

10:35 - 11:15

“Technology Trends on Cutting Edge Printed Wiring Boards”Henry H. Utsunomiya
President
Interconnection Technologies, Inc.

11:15 - 11:45

“Design Evaluation Support of SiP Substrate and Component Housing Technology”Hajime Tomokage
Department of Electronics Engineering & Computer Science
Fukuoka University

11:45 - 12:35

“Advanced Analysis Technology Applied to SiP and Embedded Substrate”Ken Sugiura
Vice-Manager
Fukuryo Semicon Engineering Corporation