Koh Young Technology Inc.
Booth#:1D04
- Exhibition Products
- [Testing Equipment for the External Appearance of the Substrate]、[Tasting and Measuring Equipment for Semiconductor Manufacturing]
- Contact
-
（Mr. M.Furuya / Mr. JD Shin）
Zip:153-789 1405 ACE Techno X, 470-5, Gasan-dong, Geumcheon-gu, Seoul, Korea
Tel:Local 043-485-4117/Korea 82-2-6670-5000
Fax：82-2-6670-5001E-mail:info@kohyoung.com
KohYoung's 3D Solder Paste In-line/Off-line Inspection system and 3D Substrate Bump Inspection system are setting a new standard in the Market. Providing metrology accuracy at In-line speeds, enables meaningful process feedback to the paste printing equipment. Ease of use and programming as well as comprehensive SPC Software complete a total solution for process optimization. KohYoung offers In-Line systems to fit different PCB sizes as well as an industry first Table top 3D Paste Inspection.
KY-3030 Series
Category：Testing Equipment for the External Appearance of the Substrate
The best SPI system in the World.
- No Shadow Effects & No Specular Problems
- Highly Reliable and Accurate Inspection Systems
- Fast Real-time 3D Inspection
- Detect all kinds of defects of Solder Pastes
- Extract Solder Paste Volume only.
- 10 min. programming time
KY-3020T
Category：Testing Equipment for the External Appearance of the Substrate
The cost-effective 3D Table Top SPI System
- Compact size version of KY-3030 series
- Excellent tool for your lab.
- Off line system performing the same functions as KY-3030 systems.
SB-3000
Category：Tasting and Measuring Equipment for Semiconductor Manufacturing
True 3D Substrate Bump Inspection
- No Shadow Effects & No Specular Problems
- Highly Reliable and Accurate Inspection Systems
- User Adjustable XY Resolution
- Detect all kinds of defects of Bumps
- Extract Solder Bump Volume only.
- 10 min. programming time
